The B560M AORUS PRO comes with upgraded power solution, incredible cooling design, all PCIe 4.0 design and outstanding connectivity to elevate your gaming experience to the next level.
OVERVIEW
POWER
THERMAL
PERFORMANCE
CONNECTIVITY
AUDIO
PERSONALIZATION
ULTRA DURABLE
SOFTWARE
DisplayPort
HDMI
Rear USB 3.2 Gen2x2 Type-C®
Intel 2.5G GbE LAN
Advanced Thermal Design
Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
5 W/mK Thermal Conductivity Pad
1* M.2 Connectors with Thermal Guard
Integrated IO Shield
2* M.2 Connectors
1*PCIe 4.0 x4 M.2
1*PCIe 3.0 x4 M.2
AMP-UP Audio
Audio Noise Guard
High-End Audio Capacitor
Nichicon MW Capacitors
Q-FLASH Onboard Button
8 Solid pin CPU Power Connector
Direct 12 1 Phase Digital Power Design with DrMOS
50A DrMOS
Premium Choke and Capacitor
6 layer PCB
PCIe 4.0 Ready PCB
2X Copper PCB
24 pin ATX Power Connector
Supports 11th Gen. Intel® Core™ Processors
Dual Channel DDR4, 4 DIMMs
Front USB3.2 Gen1 Type-C® for Connecting devices
Full PCI Express 4.0 Design
1*PCIe 4.0 x16 slot
1*PCIe 4.0 x4 M.2
RGB FUSION 2.0
Addressable LED Header*2
RGB LED Header*2
12 1 Phases Digital Power Design
Power Architecture
Power Efficiency
DIRECT POWER DESIGN
B560M AORUS motherboard uses an 12 1 phases digital CPU power design which includes both digital PWM Controller and DrMOS. These 100% digital controller and additional 8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard’s most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new Intel 11th Gen CPU.
Thermal Design
Fully Covered MOSFET Heatsink
M.2 Thermal Guard
Smart Fan 6
ADVANCED THERMAL SOLUTION
B560M AORUS uses high performance Fully Covered thermal design with high coverage MOSFET Heatsinks and thick thermal pad, providing ultimate MOSFET cooling performance for enthusiasts, overclockers and gamers.
XMP 4800
PCIe 4.0 Hardware Design
2X PCIe 4.0/3.0 x4 M2
PERFORMANCE
With the best quality components and GIGABYTE R&D design capability, the B560M AORUS is a true beast among motherboards.
Intel 2.5GbE LAN Onboard
USB 3.2 Gen2x2 TYPE-C
Front USB3.2 Gen1 Type-C®
NEXT GENERATION CONNECTIVITY
Audio
High Quality Onboard Audio Design
Delivers high quality sound resolution and sound expansion to create the most realistic sound effects for professional gamers.
The below photos are for reference only.
Audio Noise Guard with
LED Trace Path Lighting
High-End Audio
Components
RGB FUSION
RGB FUSION Software
RGB FUSION APP
DEFINITIVE AESTHETICS
B560M AORUS PRO features RGB FUSION 2.0 and offers users the option to control onboard, external light strips, and/or AORUS devices with RGB/ Addressable RGB LEDs to make their PC more unique and stylish.
Q-Flash Plus
PCIe Armor
GIGABYTE Patented Double Locking Bracket
Solid Pin
ULTRA DURABLE
GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the best components we can find for the B560M AORUS motherboard and reinforce every slot to make each of them solid and durable.
GIGABYTE BIOS & APP CENTER
Good software goes hand in hand with perfect hardware. GIGABYTE motherboard bundled several useful and intuitive software to help users to control every aspect of motherboard.
BIOS
APP Center
Easy Tune
System Information Viewer
BIOS
New User Interface
All new EASY MODE shows important hardware information in one page including CPU clock, Memory, Storage, Fan.
My Favorites
Add constantly used items into the favorite menu for quick access.
Storage Information
Show all kinds of storage information including SATA, PCIE and M.2 interface.
Changelog
List all changes before saving and exiting bios. Quickly review overall settings modification.
Intuitive Load Line Curve
Clearly show each loadline calibration setting in an intuitive curve graph.
Key Feature
Supports 11th and 10th Gen Intel® Core™ Series Processors
Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
Direct 12 1 Phases Digital VRM Solution with 50A DrMOS
Shielded Memory Routing for Better Memory Overclocking
Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
Blazing Fast Intel® 2.5GbE LAN with cFosSpeed
Dual Ultra-Fast NVMe PCIe 4.0*/3.0 x4 M.2 with Thermal Guard
SuperSpeed USB 3.2 Gen2x2 TYPE-C® delivers up to 20Gb/s Transfer Speeds
Pre-installed IO Shield for Easy and Quick Installation
RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP
Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
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